Kuo: "AirPods 3" will adopt a more complex system-in-package chip solution, similar to AirPods Pro, replacing the surface mount tech used in current versions (Mikey Campbell/AppleInsider)
Mikey Campbell / AppleInsider:
Kuo: “AirPods 3” will adopt a more complex system-in-package chip solution, similar to AirPods Pro, replacing the surface mount tech used in current versions — Apple's next-generation in-ear AirPods product will move to a more complex system-in-package chip solution …
via Techmeme
Kuo: "AirPods 3" will adopt a more complex system-in-package chip solution, similar to AirPods Pro, replacing the surface mount tech used in current versions (Mikey Campbell/AppleInsider)
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July 07, 2020
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